The Multidisciplinary World of Semiconductor Packaging - Dr Jay Chandrappan, Compound Semiconductor Catapult
Add to calCardiff University School of Engineering and online
Dr Jayakrishnan Chandrappan
Head of Advanced Packaging at the CSA Catapult
The Multidisciplinary World of Semiconductor Packaging
Tuesday 14th May 2024 at 18:00
Room N4.07, Queen’s Buildings, Cardiff University, 5 The Parade, Cardiff, CF24 3AA
The lecture will also be streamed live as a Zoom online seminar. If you would like to join the online seminar, you will need to register with this link: cardiff.zoom.us/webinar/register/WN_9OSnl7MxQX2VR6j5ScNFTA
Synopsis:
Dive into the intricate realm of semiconductor packaging materials with Dr. Jayakrishnan Chandrappan as we unravel transformational advanced packaging technologies and their diverse applications. Semiconductors form the backbone of modern technology. They power an extensive array of electronic devices essential which are essential to daily life. From smartphones and laptops to medical equipment and automotive electronics, semiconductors enable innovation and connectivity on a monumental scale.
At the heart of semiconductor manufacturing lies the critical process of packaging, which involves the encapsulation and protection of semiconductor chips. These tiny electronic components house millions of transistors and demand meticulous care, to ensure seamless integration and functionality in electronic systems. Beyond physical protection, the packaging process enables crucial electrical connections and efficient thermal management. In high-power applications, effective thermal regulation is paramount for dissipating heat and ensuring optimal device performance and reliability.
The emergence of advanced packaging technologies, including 3D packaging and System-in-Package (SiP), has revolutionised the semiconductor industry. These ground breaking innovations have ushered in smaller form factors and enhanced functionality, driving continuous progress in technology. This progress is fuelled by the myriad of semiconductor and packaging materials, which are making profound impact across a wide spectrum of applications.
Biography:
Dr Jayakrishnan Chandrappan is the Head of Advanced Packaging at CSA Catapult. He leads a multi-disciplinary team who develop innovative packaging solutions through package design and modelling, micro-assembly and rapid prototyping for Power Electronics, Photonics, and RF and Microwave applications. With over 20 years of international experience in industry and industrial research, Jayakrishnan’s expertise ranges from Material Engineering, Microelectronics, Photonics, Advanced Packaging, and reliability testing.
Before joining CSA Catapult, Jayakrishnan’s career included roles at companies such as Global Foundries Inc. (US), the Institute of Microelectronics, A-Star Singapore, Sameer and the Ministry of Electronics & Information Technology, India. He has also co-founded two start-ups.
Jayakrishnan is a recipient of Europe’s most prestigious Marie-Skłodowska-Curie fellowship and a winner of the Royal Society of Chemistry’s Emerging Technology Showcase Award.
He is an external advisory board member to the University of Bristol and the University of Leeds. He is a committee member for SEMI Europe, APC, and the International Microelectronics Assembly & Packaging Society (IMAPS) UK Chapter.
